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31.
I.H. Song 《Thin solid films》2007,515(19):7598-7602
This paper is a report on the effect of a single perpendicular grain boundary on the hot-carrier and high current stability in high performance polycrystalline silicon (poly-Si) thin film transistors (TFTs). Under a hot carrier stress condition (Vg = Vth + 1 V, Vd = 12 V), the poly-Si TFT with a single grain boundary is superior to the poly-Si without any grain boundary because of the smaller free carriers available for electric conduction. The shift of transconductance in poly-Si TFT with a single grain boundary is less than 5% after hot carrier stress during a period of 1000 s. The shift of transconductance is about 25% in the case of the poly-Si TFTs without a grain boundary in the channel. On high current stress, the poly-Si TFT without the grain boundary is less degraded than the poly-Si TFT with the grain boundary because the concentrated electric field near the drain junction is lower. 相似文献
32.
Andreas Karageorghis 《Journal of scientific computing》1991,6(1):21-26
The way boundary conditions are imposed when applying Chebyshev collocation methods to Poisson and biharmonic-type problems in rectangular domains is investigated. It is shown that careful selection of the number of collocation points leads to a linear system ofn linearly independent equations inn unknowns. 相似文献
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35.
Giulio Croce Paola Dagaro Carlo Nonino 《International Journal of Heat and Mass Transfer》2007,50(25-26):5249-5259
36.
Jaber Almedeij 《Powder Technology》2008,186(3):218-223
An empirical relationship of drag coefficient of flow around a sphere is developed for the entire range of Particle Reynolds numbers reported in the literature from Stokes regime to the condition when turbulent boundary layer prevails. The relationship is obtained using an approach to match asymptotically the wide trend of drag coefficient. The matching approach, which relies on dividing the wide trend into smaller segments that can be combined into an overall relationship, employs regression techniques and thus warrants the best-fit accuracy results. The relationship is calibrated with experimental data available in the literature covering the entire range for Reynolds numbers up to ~ 106. For Reynolds values greater than 106, the relationship renders a drag coefficient of 0.2. The performance of the relationship is tested and compared with other suitable models found in the literature. This relationship is also transformed into an explicit expression for settling velocity calculations. 相似文献
37.
高温和低张应力引起的非平衡晶界偏聚动力学(Ⅱ)--实验结果的动力学模拟 总被引:2,自引:2,他引:0
以文献[1]建立的张应力引起的非平衡晶界偏聚动力学方程模拟了Shinoda T等的磷在钢中的应力时效实验结果和Misra R D K的硫在钢中的应力时效实验结果,模拟结果与实验结果互相吻合。通过模拟发现,张应力使磷-空位复合体以及硫-空位复合体在钢中的扩散系数均增加3个数量级,且磷原子和硫原子的扩散系数分别降低3个和5个数量级。 相似文献
38.
Ferdinando Auricchio Lorenza Petrini 《International journal for numerical methods in engineering》2004,61(6):807-836
An always increasing knowledge on material properties as well as a progressively more sophisticated production technology make shape memory alloys (SMA) extremely interesting for the industrial world. At the same time, SMA devices are typically characterized by complex multi‐axial stress states as well as non‐homogeneous and non‐isothermal conditions both in space and time. This aspect suggests the finite element method as a useful tool to help and improve application design and realization. With this aim, we focus on a three‐dimensional macroscopic thermo‐mechanical model able to reproduce the most significant SMA features (Int. J. Numer. Methods Eng. 2002; 55 : 1255–1264), proposing a simple modification of such a model. However, the suggested modification allows the development of a time‐discrete solution algorithm, which is more effective and robust than the one previously discussed in the literature. We verify the computational tool ability to simulate realistic mechanical boundary value problems with prescribed temperature dependence, studying three SMA applications: a spring actuator, a self‐expanding stent, a coupling device for vacuum tightness. The effectiveness of the model to solve thermo‐mechanical coupled problems will be discussed in a forthcoming work. Copyright © 2004 John Wiley & Sons, Ltd. 相似文献
39.
YOSHIHARU KARIYA TADATOMO SUGA 《Fatigue & Fracture of Engineering Materials & Structures》2007,30(5):413-419
This paper details the deformation mechanism and low‐cycle fatigue life of eutectic solder alloys at high temperature (around 0.8Tm). Grain boundary sliding generally nucleates a wedge‐type cavity that reduces the low‐cycle fatigue life of metals. In this study, grain boundary sliding has promoted intergranular failure contributing to the reduction in fatigue life of Sn–Ag–Cu alloy. However, grain boundary sliding has exerted no deleterious effects on fatigue resistance of eutectic Pb–Sn and Bi–Sn alloys. The phase boundary sliding with very fine microstructure induces exceptional ductility in these alloys leading to superior low‐cycle fatigue endurance for theses eutectic Pb–Sn and Bi–Sn alloys. 相似文献
40.
Boundary objects are a critical, but understudied, theoretical construct in CSCW. Through a field study of aircraft technical
support, we examined the role of boundary objects in the practical achievement of safety by service engineers. Their resolution
of repair requests was preserved in the organization’s memory via three compound boundary objects. These crystallizations
did not manifest a static interpretation, but instead were continually reinterpreted in light of meta-negotiations. This suggests
design implications for organizational memory systems which can more fluidly represent the meta-negotiations surrounding boundary
objects. 相似文献